Problem, approach, outcome.
Heat is the bottleneck.
AI racks, power electronics and compact devices generate higher heat densities than conventional cooling architectures can handle efficiently.
License the heat-transfer technology.
Cooling OEMs integrate EHP into thermal systems to move heat more efficiently across longer distances and more complex layouts.
Heat becomes an asset.
Higher-density deployment, lower cooling energy, improved reliability and potential reuse of captured heat.
From thermal load to reusable heat.
AI racks & electronics
High density heat sources generate the load.
EHP – enabled heat transfer
Moves and lifts heat at high efficiency.
Heat rejection or reuse
Routed to rejection or a reuse loop.
Lower energy intensity
Higher system reliability and efficiency.
For hyperscale, colo & electronics OEMs.
Higher density
Support rising compute and electronics thermal loads without hitting a cooling ceiling.
Lower cooling burden
Reduce the energy penalty of moving heat and improve efficiency metrics like PUE.
OEM – ready licensing
Integrate into existing cooling products without ENOVER becoming the manufacturer.
